Suzhou Xingyao Microelectronics is a professional semiconductor wafer fabrication solutions provider, specializing in wafer manufacturing, MEMS specialty processes, wafer-level packaging and testing, and wafer inspection. We provide customers with one-stop, full-process technical support and related services. Our business covers three core areas: product design and R D, wafer micro/nano fabrication, and high-precision testing and analysis. Relying on a complete system for technology R D, process processing, project delivery, and quality control, we can quickly respond to customer needs and stably and efficiently deliver high-standard process products and technical services.

Lithography process is one of the most important processes in semiconductor packaging.
1.The Photo-lithography process is to transfer the pattern on the mask plate to the wafer
2.The accuracy and stability of photolithography have a important impact on the quality and reliability of advance packaging products.
Resolution: within 2um
Exposure light source: ghi/gh/i-line/mercury lamp
Engraving accuracy: within 1um
Verticality of rubber type: 90 ° ±1 °
Exposure depth: 8um@1um; 20um@2um;30um@3um
support mode: 200mm / 300mm, WEE (Wafer edge exposure )and WEP(Wafer edging protect)
Exposure wavelength: 365nm
Exposure adhesive thickness: 1-110um
Device application: Wafer size 8/12inch

1. The photoresistdropped onto the wafer surface；
2. The wafer rotates at high speeds to generate centrifugal force, causing the photoresist to evenly distribution and form a thin film;
Edging: ≤2mm, tolerance ±0.3mm
Speed: 0 rpm to 5000 rpm±1rpm
Baking: 23~180℃
Temperature: 22±2℃
Humidity: 40~60%
Cavity: 4C
Device application: Wafer size 8/12inchAdhesive thickness: 1-110um